Loranger International - Burn-In Systems

 

Loranger Boards

Burn-in Boards and Sockets

Burn-in Board with Programmable Edge Fingers

Board with Programmable Edge fingers for BGA Packages

Loranger Environmental Test and Burn-In Boards are custom designed to meet your requirements. Complete Turn-Key Boards and Sockets are manufactured according to your package drawing, schematic, and component list.

Loranger utilizes over 30 years of experience in designing Test and Burn-In boards to offer the best performance. All sockets and boards are 100% electrically tested prior to shipment.

QFN Burn-in Socket and Board with Center Heat Pipe

QFN Socket with Center Heat Pipe on Programmable Universal Board

Universal Boards with Sockets and Program Cards

Universal Burn-in Board for TO Devices

Universal Programmable Board with Edge Connectors

Loranger Universal Test and Burn-In Boards offer a long life-cycle for a give package style. Edgeconnectors are connected to a group of sockets, and a program card can be inserted into the edgeconnector to achieve the required schematic to each package.

Loranger program cards are available in various configurations, I/O and pitches. Custom designs with assembled components are also available.

User Configured Program Cards

Universal Program Cards for Designing a Burn-in Schematic

HAST / Humidity Boards and Sockets

Humidity and HAST Board

Board for HAST and Humidity Use to 130 C

Loranger boards for Humidity (typically 85 C and 85% Relative Humidity), and HAST (typically 130 C, 85% Relative Humidity and elevated pressure), use special board materials and design considerations.

Options include special board materials, SMT components, and multiple board layers with traces only on inner layers.

Compression Mount BGA Socket on 130 C HAST Board

BGA Socket and SMT Components on HAST Board

High Frequency Boards and Sockets

Socket and Board for Microwave Package

High Frequency Board with Package Leads on Board

Loranger offers over 30 years of experience in designing boards and sockets for high frequency burn-in. Low inductance contacts are used, or device leads can make contact directly to gold plated pads on the board.

Trace width and length, as well as characteristic impedence and signal termination are considered in the design.

Socket and Board for Microwave Package

High Frequency Board with Package Leads on Board

Up to 300 C Use Boards and Sockets

Metal Board and Plastic DIP Sockets

Metal Board and Plastic SMT Sockets for up to 300 C Use

For tests that require temperatures up to 300 C, Loranger offers multiple solutions. Standard Plated Thru Hole sockets are available in high temperature plastics and metal contacts.

For up to 300 C use, metal boards and solder-free, surface mount DIP sockets are available.

Compression Mount DIP Sockets for up to 300 C Use

Metal Board and Plastic SMT Sockets for up to 300 C Use

Custom Monitoring, Signal Generation and Fuse Boards for Burn-in Systems
Burn-in System Back Plane Board


Loranger offers complete design and manufacturing services for back plane boards for various burn-in and test systems.

Designs include fuse, signal generation, and monitoring boards, as well as custom designs.

Burn-in System Back Plane Board
About Us News Products Contact Us ©Copyright 2010 Loranger Corp. All rights reserved.