|
• |
Designed
to
Connect to Packages for Burn-in and Test
Accommodating Variations in Package Thicknesses |
|
• |
Contact
Pitches from 0.35mm and greater |
|
• |
Direct-Contact
Sockets Join Package Solder Balls to
Surface Mount Pads on Board |
|
• |
Up
to 20 Grams
Contact Normal Force per Solder Ball
for Reduced Witness Marking assures Good Contact with
High Hertz-force Concentration |
|
• |
Socket
Contact
Wipes Diameter of Solder Ball |
|
• |
Low-Profile
and Small Footprint Design Increases Board
Density |
|
• |
Surface-mount
Design Irons Out Coplanarity Issues and
Reduces Need for Extra Board Layers |
|
• |
Accommodates
Ceramic, Plastic Over-molded, Glob Top,
Tape, Metal Heat Sink, Super BGA(CSP) Packages, etc. |
|
• |
Handler
Compatible via Guideplate Adapter Kit |
