Loranger International, founded over 30 years ago, specializes in designing, manufacturing and marketing high quality sockets for burn-in, characterization and test. As semiconductor devices become more hi-tech and sophisticated, their packaging becomes smaller and more intricate. The needs for supporting our customers' infrastructure, providing timely delivery, and after sales service, have become more crucial. With our own in-house research, design, development and manufacturing facilities, Loranger International is able to offer our customers quick time-to-market solutions in quality burn-in, characterization and test sockets for the latest packaged devices and pitches of 0.25 mm and greater. Please feel free to review the following technical articles:
Technical Articles: Procedures for Socket Assembly, Printed Circuit Board Cleaning, Thermal Management etc.
Board Components: Specifications for Printed Circuit Board Components
Board Materials: Material Properties for Printed Circuit Boards
Board Design: Printed Circuit Board Design Guidelines
Contact Materials: Material Properties for Socket Contacts
Socket Plastics: Material Properties for Socket Plastics
If you have specific needs for QFN, BGA/CSP, LGA, TO, LCC, Gullwing and Surface Mount packages with pitches of 0.25 mm and greater, please contact one of our experienced sales and support representatives immediately. With over 30 years of industry experience in burn-in, characterization and test sockets, Loranger International will be able to answer your questions and provide quotes on socket solutions that meet your needs.