Thousands of Burn-in and Test Sockets.

Loranger International Corporation designs and manufactures thousands of socket styles for the burn-in and test of semiconductors and electronic components. Some of the socket styles are listed below.

Thumbnail Image 1

QFN Sockets

• 0.22mm Pitch and Greater • Dual Row QFN Socket Options Available • Non-Magnetic Socket Options Available • Accurate, Tightly-controlled Package Fit • Optional Heat Sink and Case Contacts • PTH or Compression Mount Contacts • Optional "Heat Pipe" to Printed Circuit Board • Zero-insertion-force • 1,300+ ClamShell and Open Top QFN Sockets

Thumbnail Image 1

BGA Sockets

• 0.22mm Pitch and Greater • Accommodates Package Height Variations • Non-Magnetic Socket Options Available • Accurate, Tightly-controlled Package Fit • Contacts Connect Solder ball to Board Pad • Optional Heat Sink • Low Profile and Small Footprint • Zero-insertion-force • Surface Mount Design / Solder-Free

Thumbnail Image 1

Gull Wing Sockets

• Kelvin, Double Duty Kelvin, and Non Kelvin • Zero Insertion Force Clam Shell Design • Non-Magnetic Socket Options Available • Accurate, Tightly-controlled Package Fit • Optional Case Contacts • Optional Heat Sinking • Fine Pitches • Contact Wiping Action for Reliable Connection

Thumbnail Image 1

TO Sockets

• Top-Loading and Clam Shell Designs • Kelvin and Single-Sided Contacts • Small Size Offers Maximum Board Density • Package Standoffs Aid Package Removal • Wide Funnel Entry Guides Package Leads • Positive Contact Wiping Action • Low Profile and Small Footprint • ClamShell Socket Design

Thumbnail Image 1

LCC Sockets

• Easy Loading and Unloading • Positive Contact Wiping Action • Open Top and Clam Shell Designs • 0.25 mm and Greater Pitches • Dual Height Contact Options • Live or Dead Bug Loading Options • Low Profile and Small Footprint • Open Top Designs Independent of Package Height

Thumbnail Image 1

SMD Sockets

• Top Loading and Clam Shell Designs • Kelvin and Single-Sided Contacts • Zero Insertion Force Clamshell Designs • Low Insertion Force Open Top Designs • Optional Multiple Devices per Socket • 0.25 mm pitches and Greater • Distance Between Package Sides with Leads is Defined as the Package Width Dimension

Thumbnail Image 1

Axial Sockets

• Kelvin and Non Kelvin Contacts • Building Block Strip Sockets • Accepts Various Lead Diameters • Contact Wiping Action on Lead Diameter • Optional Mounting Ears for Screw Mounting • Modifications Available • Various Pitches Available

Thumbnail Image 1

LGA Sockets

• 0.22mm Pitch and Greater • Accommodates Package Height Variations • Non-Magnetic Socket Options Available • Accurate, Tightly-controlled Package Fit • Contacts Connect Land pad to Board Pad • Optional Heat Sink • Low Profile and Small Footprint • Zero-insertion-force Surface Mount Design / Solder-Free

Thumbnail Image 1

Microwave Sockets

• Standard and Custom Designs • For Microwave Packages • For Custom Module Packages • Optional 50 Ohm Impedance Designs with Matching Board Layouts • Optional Heat Sinks • Optional Direct Contact of Device Leads onto Board Traces

Thumbnail Image 1

Edge Connectors Sockets

• Independent Contacts • Pitches of 0.100", 0.150" and 0.156" • Heavy Duty for Long Life • V Slot Guides Insertion of Board • For Board Thickness of 0.054" to 0.070" • Optional Mounting Ears • Non-Bifurcated Contacts for Increased Current • Positive Wiping Action for Reliable Contact

Thumbnail Image 1

SIP Sockets

• Kelvin and Non Kelvin • Top Loading • For In-line TO and SIP Packages • Modified and Custom Sockets Available • May Accommodate More than One Package • Fit is Independent of Package Body L, W and H • Various Pitches Available

Thumbnail Image 1

ZIG ZAG Sockets

• Top-Loading and Clam Shell Designs • Kelvin and Single-Sided Contacts • Modified and Custom Sockets Available • Variety of Pitches and Package Lead Sizes • For In-line and Zig-Zag Packages • Positive Contact Wiping Action • Optional Zero-Insertion Force

Thumbnail Image 1

DIP Sockets

• Top Loading Designs • High Side Contacts Help Align Package Leads • Positive Contact Wiping Action • Low Insertion Force • Bottom Socket Standoffs Help Board Cleaning • Various Sizes and I/O • Unloading Tool Also Available

Thumbnail Image 1

Flat Pack Sockets

• Open Top and Clam Shell Designs • Accommodate Standard Carriers • Rugged Construction • Wire-Formed Contacts • Solid Clamping of Device Carrier • Various Sizes and I/O Available

Thumbnail Image 1

Kelvin Clips

• Kelvin Alligator Clips • Up to 175 C Use • Optional Attached Wiring • Reliable, Normally Closed Contacts • Torque Wrench Kits also Available for Socket Assembly • Fixed and Variable Torque Wrench Kits

About Us


Loranger International Corporation designs and manufactures burn-in and test sockets, printed circuit boards and environmental chamber systems for the electronics manufacturing industry.

Loranger International Corporation sockets are optimized for today’s small, fine pitch electronic packages including QFN, as well as for older style packages.

Loranger International Corporation burn-in and test sockets are used worldwide in programs including defense, guidance, automotive, music, communication and space exploration.

Contact Us


Loranger International, Inc.
817 Fourth Ave.
Warren, PA 16365
303 Brokaw Road
Santa Clara, CA 95050
Phone
Asia and North America West: (408) 727-4234
Europe and North America East: (814) 723-2250
Email: sales@loranger.com
Sales Representative List: Contact Us